Crack Direction of Growth¶
Validation of crack path prediction under mixed-mode conditions. In all cases, the maximum tangential stress criterion is used — the crack turns to eliminate Mode II, growing in pure Mode I. This is confirmed by KII remaining approximately zero along the computed growth path.
5.1 ANSYS Benchmark — Plate with Four Holes¶
A 100 x 100 mm square plate with four circular holes and an edge crack on the left side, under 10 MPa uniaxial tension. The crack navigates between the holes as it grows.
Degrees of Freedom Comparison:
| Method | DOF |
|---|---|
| ANSYS (FEM) | 138,700 |
| Dedicated FEM | 138,700 |
| XdTd (BEM) | 1,226 |
5.2 Rectangle with Two Holes and Edge Crack¶
A rectangular plate with two asymmetrically placed holes and a bottom edge crack under horizontal tension. The crack curves between the holes.
5.3 Plate with Hole and Edge Crack¶
A 40 x 160 mm plate with a circular hole and a left edge crack under 10 MPa tension. The crack is attracted by the hole's stress field.
5.4 Plate with Two Edge Cracks¶
A 20 x 40 mm plate with two slightly offset edge cracks growing inward from opposite sides under 10 MPa tension. The crack tips are mutually attracted.
